3DIC Technology Drivers and Roadmaps
By Ed Korczynski, Sr. Technical Editor After 15 years of targeted R&D, through-silicon via (TSV) formation technology has been established for various applications. Figure 1 shows that there are...
View Article2D Materials May Be Brittle
By Ed Korczynski, Sr. Technical Editor International researchers using a novel in situ quantitative tensile testing platform have tested the uniform in-plane loading of freestanding membranes of 2D...
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